工作內容:
Sustain and improve process / SPC to meet quality, cost, productivity requirements. Process improvement to eliminate inherent process weakness.
•Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices •Review ESPC charts using SPACE. Know all the rules for ESPC •Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE •Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View) •Upload recipe, check recipe and ensure recipe content compliance using RMS •Raise PCRB and understands the requirements for PCRB opening, follow through with qual plan, analyze data using required software and CR closure •Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN. Provide guidance to junior Engineers •Setup and troubleshoot issues in recipes/job files in all metrology tools within the Module •Startup and qualify new process and new equipment within scheduled timeline. Work closely with Equipment Engineer on new equipment acceptance. Know the concept of repeatability and reproducibility (R&R) run •Analyze data from passed down to identify chronic process issues, establish improvement programs and lead engineers to resolve them. Establish CAS / procedures to be followed and work with other departments for resolution if required •Coach and show Engineers how to use the toolsets more effectively. Provide feedback/training to Process Engineers on their troubleshooting skills, understanding of processes, decision making, risk assessment •Lead Engineers on improvement projects, process window study and provide improvement plans to reduce OOC and improve CPK. Coach engineers on process matching between equipment to reduce variation. Perform analysis / DOE to find factors for better tool matching • Lead and mentor the Engineers to work on reducing process constraint so that Mfg can have more flexibility •Work as a team with both Equipment and Mfg Engineers to meet Module objectives. Drive team to meet key indices of Uptime and OEE as per the goals set for these indices
1. Bachelor Degree in Engineering or related field.2. At least 5 years experiences in semiconductor Thin Film CMP Process . Including 2 years leadership experience leading a team (for Principal level).3. Project management skills and aptitude.4. Able to read and understand electrical / electronic /Microelectronics / Chemical Process Engineering / Chemistry / Physics5. Able to lead and transfer knowledge to a small team6. Good communication and troubleshooting skills.7. Willing to relocate and work in Singapore site.